| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device having a novel structure.SOLUTION: The semiconductor device, on a semiconductor wafer on which a plurality of chip regions are formed, has a first chip region, a second chip region and a third chip region which are adjacent in a direction from a wafer outer peripheral edge toward the inside of the wafer out of the plurality of chip regions, and has the third chip region arranged with a gap having a first width adjacent to the inside of the wafer further from the second chip region in the direction, and the first chip region arranged with a gap having a second width wider than the first width adjacent to the wafer outer peripheral edge further from the second chip region in the direction. |
