METALLIC MATERIAL RECOVERY METHOD

摘要

PROBLEM TO BE SOLVED: To enable metallic material constituting wiring and an electrode and the like of a semiconductor chip having an element composed of a semiconductor to be more easily separated from the semiconductor chip and recovered.SOLUTION: There is provided a metallic material recovery method comprising: a step S101 of bringing a semiconductor chip having an element composed of a semiconductor into contact with mercury and dissolving the metal constituting the electrode and wiring of the semiconductor chip, in the mercury (first step); and a step S102 of separating the metal from the mercury in which the metal is dissolved (second step).