SILICON-BASED HEAT-DISSIPATION DEVICE FOR HEAT-GENERATING DEVICES

摘要

Embodiments of a silicon-based heat-dissipation device and an apparatus including a silicon-based heat-dissipation device are described. In one aspect, an apparatus includes a silicon-based heat-dissipation device which includes a base portion and a protrusion portion. The base portion has a first primary side and a second primary side opposite the first primary side. The protrusion portion is on the first primary side of the base portion and protruding therefrom. The protrusion portion includes multiple fins. Each of at least two immediately adjacent fins of the fins of the protrusion portion has a tapered profile in a cross-sectional view with a first width near a distal end of the respective fin being less than a second width at a base of the respective fin near the base portion of the heat-dissipation device.

主权项

1. An apparatus, comprising:
a silicon-based heat-dissipation device comprising:
a base portion having a first primary side and a second primary side opposite the first primary side; anda protrusion portion on the first primary side of the base portion and protruding therefrom, the protrusion portion comprising a plurality of fins,wherein the second primary side of the base portion is configured to accommodate one or more heat-generating devices being embedded therein or physically coupled thereto to dissipate at least a portion of heat generated by the one or more heat-generating devices to the silicon-based heat-dissipation device by conduction,wherein the base portion comprises a slit that communicatively connects the first primary side and the second primary side of the base portion, at least one portion of the slit extending in a direction perpendicular to a direction in which the plurality of fins extend, and wherein at least one fin of the plurality of fins is dissected by the at least one portion of the slit into two separate fins.