PRINTED WIRING BOARD

摘要

A printed wiring board comprises a pattern layer, an insulating layer and a ground layer laminated in an upper-lower direction. The printed wiring board is formed with one or more vias. The insulating layer is provided between the pattern layer and the ground layer. The ground layer is formed with a ground pattern. The pattern layer is formed with one common ground plane and two or more pads. The pads are arranged in a lateral direction. The common ground plane is located forward of the pads in the front-rear direction. The vias include a first via that connects the common ground plane and the ground pattern with each other. The pads include one or more ground pads and one or more signal pads. The ground pads are connected with the common ground plane. The signal pads are unconnected with the common ground plane.

主权项

1. A printed wiring board comprising a pattern layer, an insulating layer and a ground layer laminated in an upper-lower direction, wherein:
the printed wiring board is formed with one or more vias; the printed wiring board has a front end and a rear end in a front-rear direction perpendicular to the upper-lower direction; the insulating layer is provided between the pattern layer and the ground layer; the ground layer is formed with a ground pattern; the pattern layer is formed with one common ground plane and two or more pads; the pads are arranged in a lateral direction perpendicular to both the upper-lower direction and the front-rear direction; each of the pads is positioned at a position which is nearer to the front end than to the rear end in the front-rear direction; the common ground plane is located forward of the pads in the front-rear direction; the vias include a first via that connects the common ground plane and the ground pattern with each other; the pads include one or more ground pads and one or more signal pads; the ground pads are connected with the common ground plane; and the signal pads are unconnected with the common ground plane.