HIGH SPEED LOW TEMPERATURE METHOD FOR MANUFACTURING AND REPAIRING SEMICONDUCTOR PROCESSING EQUIPMENT AND EQUIPMENT PRODUCED USING SAME

摘要

A method for the joining of ceramic pieces into an assembly adapted to be used in semiconductor processing. The joined pieces are adapted to withstand the environments within a process chamber during substrate processing, chamber cleaning processes, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The ceramic pieces may be aluminum nitride and the pieces may be brazed with aluminum. The joint material is adapted to withstand both the environments within a process chamber during substrate processing, and the oxygenated atmosphere which may be seen within the shaft of a heater or electrostatic chuck. The joint is adapted to provide a hermetic seal across the joint. The joined pieces are adapted to be separated at a later time should rework or replacement of one of the pieces be desired.

主权项

1. A heater used in semiconductor processing, said heater comprising:
a plate, said plate comprising a first ceramic; a shaft, said shaft comprising a second ceramic, said second ceramic different than said first ceramic, said shaft comprising an interior space and an exterior, said shaft coupled to a bottom surface of said plate; a first joining layer disposed between said plate and said shaft, wherein said first joining layer hermetically seals said interior space of said shaft from said exterior of said shaft through said first joining layer.