发明名称 POLISHING COMPOSITION
摘要 The present invention provides a polishing composition suitable for the polishing of objects to be polished that have a layer containing a group IV material, the polishing composition making it possible to prevent the dissolution of the group IV material. The present invention is a polishing composition containing an oxidizing agent that contains halogen atoms, and an organic compound that contains an amide bond.
申请公布号 WO2015151673(A1) 申请公布日期 2015.10.08
申请号 WO2015JP55682 申请日期 2015.02.26
申请人 FUJIMI INCORPORATED 发明人 TAMADA, SHUICHI
分类号 C09K3/14;B24B37/00;H01L21/304 主分类号 C09K3/14
代理机构 代理人
主权项
地址