| 摘要 |
According to an embodiment of the present invention, a film forming apparatus includes: a discharge unit which discharges a film forming material; a voltage applying unit which makes the film forming material have a high potential with respect to an object to have a film by applying voltage to the film forming material; a mask which is arranged on a location where the mask overlaps an unapplied construction unit in the direction from the discharge unit toward the unapplied construction unit of the object to have a film; and a potential adjustment unit which makes a potential of the mask the same as a potential of the object to have a film. |
