发明名称 METHOD FOR MANUFACTURING LIGHT EMITTING DEVICE PACKAGE AND LIGHT EMITTING DEVICE PACKAGE STRIP
摘要 The present invention relates to a method for manufacturing a light emitting element package and a light emitting element package strip which can be used for a display purpose or a lighting purpose. The method for manufacturing a light emitting element package comprises: a lower adhesive sheet preparation step of preparing a lower adhesive sheet whose upper surface is coated with an adhesive; a mask affixing step of affixing a mask having one or more light emitting element package accommodation cavities to the upper surface of the lower adhesive sheet; a light emitting element mounting step of mounting one or more light emitting elements on the lower adhesive sheet to accommodate the light emitting elements in the light emitting element accommodation cavities; a molding member forming step of forming a molding member on the light emitting element accommodation cavities at once to enclose the light emitting elements; an upper adhesive sheet affixing step of affixing an upper adhesive sheet to the molding member and an upper surface of the mask; a lower adhesive sheet and mask separating step of separating the lower adhesive sheet and the mask from the light emitting elements and the molding member to expose lower surface electrode pads of the light emitting elements; and a package singulation step of removing the upper adhesive sheet to singulate a unit package.
申请公布号 KR101557952(B1) 申请公布日期 2015.10.08
申请号 KR20150045495 申请日期 2015.03.31
申请人 LUMENS CO., LTD. 发明人 CHOI, HONG GEOL;CHOI, SUNG OK;GIM, SANG HYUB
分类号 H01L33/62;H01L33/52 主分类号 H01L33/62
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