| 摘要 |
The present application relates to a method for forming a stack of thin-walled packages, wherein all of said thin-walled packages in the stack are of the same shape and size, and each thin-walled package has a lower surface with a length (I x ) extending in an x-direction and a length (I y ) extending in a y-direction of an x-y plane. The stack comprises two or more distinct layers of thin-walled packages, wherein each layer is of the same size with a horizontal extension in the x-direction and in the y-direction of an x-y plane and a vertical extension in a z-direction perpendicular to the x-y plane. The method comprises the steps of:
a) arranging a layer of three or more packages in a side-by-side configuration with said lower surfaces of said packages in a plane parallel to the x-y plane,
b) arranging a subsequent layer of three or more packages on top of a previously arranged layer in a side-by-side configuration with said lower surfaces of said packages in said subsequent layer arranged in a plane parallel to the x-y plane and with said subsequent layer being offset in relation to said previous layer in the x-direction and/or in the y-direction such that the center point of the smallest rectangle that can be drawn around said subsequent layer in the x-y plane is offset a distance d x in the x-direction and/or a distance d y in the y-direction in relation to the center point of the smallest rectangle that can be drawn around said first layer in the x-y plane,
c) repeating step b) one or more times wherein each subsequent layer is arranged on top of a previous layer and wherein the offset distances d x in the x-direction and/or a distance d y in the y-direction are the same for all subsequent layers and said offset direction are shifted in each repetition of step b). |
