Copper bond wire and method of manufacturing the same

摘要

The invention is related to a bonding wire having a yield strength in the range of 50 to 120 MPa, the bonding wire comprising:
a core (2) with a surface,
wherein the core (2) comprises copper as a main component,
wherein an average size of crystal grains in the core (2) is between 2.5 µm and 30 µm, and
wherein the wire core (2) contains palladium in an amount between 0.5 and 3 weight-%.