| 摘要 |
Systems and methods for automated inspection of fillet formation along on or more peripheral edges (13a) of a packaged microelectronic device (14) that is attached to a supporting substrate (16), such system (10) including a feedback loop for controlling fillet formation. More specifically, the system (10) includes a dispensing system (18) configured for dispensing underfill material (22) onto the supporting substrate (16). The system (19) further includes an automated optical inspection (AOI) system (19) configured for determining a value of a measurable attribute of the fillet (12), such as whether the fillet (12) is properly dimensioned, i.e., sized and shaped. A feedback loop (66) is included between the dispensing system (18) and automated optical inspection system (19). The feedback loop (66) is configured to communicate information from the AOI system (19) to the dispensing system (18) to permit adjustment of one or more operating parameters thereof, thereby maintaining proper dimensions of the fillet (12). |
