ELECTROLESS METAL DEPOSITION FOR MICRON SCALE STRUCTURES

摘要

A method for electroless metal deposition on a surface in a finely dimensioned space (e.g. the bore of a hollow fibre) includes introducing into the space an electroless plating solution that has a nil or relatively low plating rate at normal room temperature, and thereafter heating the structure to an elevated temperature for a period sufficient to cause metal to plate on the wall surface. The introducing and heating may be repeated as necessary or desired to build up a specified thickness.