发明名称 照明装置
摘要 [Object] To increase a light emitting region in a light emitting surface side while reducing a thickness in an illumination device. [Means for Settlement] An illumination device 1 includes a light source part 2 having a case 20 for accommodating a light emitting panel 5 and a wiring board 6 placed on a non-luminous surface side thereof, and an attachment part 3 having a housing 30 for accommodating a circuit board 8 and adapted to be detachable with respect to the light source part 2. The case 20 includes a wiring board accommodation part 24, and the housing 30 includes a circuit board accommodation part 32, whereby the wiring board 6 and the circuit board 8 are accommodated so as not to be overlapped to each other in a state that the attachment part 3 and the light source part 2 are attached. With this configuration, since the wiring board 6 and the circuit board 8 are both placed on the non-luminous surface side of the light emitting panel 5, the light emitting region on the light emitting surface side can be increased, and since the wiring board 6 and the circuit board 8 are not overlapped, the thickness of the illumination device 1 can be reduced.
申请公布号 JP5789757(B2) 申请公布日期 2015.10.07
申请号 JP20110048098 申请日期 2011.03.04
申请人 パナソニックIPマネジメント株式会社 发明人 河地 秀治;宮川 昇;小西 洋史;棚橋 理
分类号 F21V23/00;F21V19/00;H01L51/50 主分类号 F21V23/00
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