| 摘要 |
To improve noiseproof performance. A semiconductor device (1) includes a circuit substrate (10), an enclosing case (20), and a metal part (30). A control circuit (11) is mounted on the front surface of the circuit substrate (10). The enclosing case (20) is a resin case in which semiconductor elements (23) are installed. The metal part (30), included inside the enclosing case (20), includes a first mounting portion (31a), a second mounting portion (32a), and a bus bar (33a). The first mounting portion (31a) mounts the circuit substrate (10) on the enclosing case (20), and is connected to a ground pattern of the circuit substrate (10) when mounting. The second mounting portion (32a) mounts an external instrument (4) on the enclosing case (20), and is grounded when mounting. The bus bar (33a) connects the first mounting portion (31a) and second mounting portion (32a). |
