发明名称 ダイボンダ及び半導体製造方法
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing method in which an application work is performed in a short period of time using a plurality of syringes and the application form is stable, in view of the problems that it requires time to apply a large area when application is performed with one syringe, and that it is difficult to keep a flowable material to be applied even due to difference (pressure, paste amount, etc.) in syringes when application is performed with a plurality of syringes, which easily causes variation in application and disconnection. <P>SOLUTION: There is provided a method of applying a paste on a substrate which makes a relatively parallel movement over an arbitrary distance in X-axis and Y-axis directions by drawing and applying a predetermined pattern with a flowable material. In the method, the plurality of syringes draw and apply different sub-patterns, which forms one pattern. <P>COPYRIGHT: (C)2013,JPO&INPIT</p>
申请公布号 JP5789389(B2) 申请公布日期 2015.10.07
申请号 JP20110063524 申请日期 2011.03.23
申请人 发明人
分类号 H01L21/52;B05C5/02;B05C11/00;B05D1/26;B05D7/24 主分类号 H01L21/52
代理机构 代理人
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