| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To shorten handling time in a measurement test and to save even a device once determined as defective to raise yield. <P>SOLUTION: As a measurement test result obtained by performing a measurement test by a handler device 5, a plurality of pieces of rank information are added besides quality identification information and stored in a database 6 as tape map data. In this case, a semiconductor device of one piece of rank information among the plurality of pieces of rank information is left instead of punching of a defective device, and semiconductor devices of the pieces of rank information other than the one piece of rank information are punched based on the tape map data in the database 6 by a concentration punching device 7, and tape reorganization is performed for all or a part of the semiconductor devices among the pieces of punched rank information for every piece of the rank information. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
