| 摘要 |
An electronic component housing container includes a container body housing an electronic component inside a cavity constituted by a bottom plate (1) and a side wall (2) which surrounds a center region of the bottom plate (1), and an input-output terminal (3). The input-output terminal (3) includes an insulation member (5), a pin terminal (4), and a ring-like member (6). The insulation member (5) is bonded to a periphery of an opening of a through hole (2a) provided in the side wall (2) so as to close the through hole (2a). The pin terminal (4) has a flange portion (4a) protruding from an outer peripheral surface of the pin terminal, and is pierced through the insulation member (5), and the flange portion (4a) is bonded to the insulation member (5). The ring-like member (6), through which the pin terminal (4) passes, is bonded to the outer peripheral surface of the pin terminal (4) and to the insulation member (5), on an opposite side to a surface of the insulation member (4) to which the flange portion (4a) is bonded. Problems arising in the bonding portion of the insulation member (5) due to a force applied to the tip of the pin terminal (4) are alleviated. |
