INSPECTING ZIG, CUTTING DEVICE, AND CUTTING METHOD

摘要

Provided are a cutting device and a cutting method which accommodate each electronic component by pieces after inspecting the exterior of the electronic component. The cutting device comprises: a drying table for adsorbing a plurality of electronic components; an absorption pump which is connected to a plurality of pipelines prepared in the drying table; a drying unit which dries the electronic component on the drying table; a temporary maintaining unit for receiving and adsorbing the electronic components from the drying table; a plate which is prepared on the plate and is placed on the drying table; a plurality of third pipelines which are connected to the first pipelines as the pate is put on the drying table; a lid which is put on the plate and is detachable to the plate; a screw for fixing the plate and the lid; and an accommodation box where the electronic components are accommodated apiece. A worker removes the lid from the plate, and inspects the electronic components using a microscope.