立体的回路基板及びその製造方法,申请号JP20120056537-传众专利搜索

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发明名称	立体的回路基板及びその製造方法
摘要
申请公布号	JP5790550(B2)	申请公布日期	2015.10.07
申请号	JP20120056537	申请日期	2012.03.13
申请人		发明人
分类号	H05K3/28;H05K1/02;H05K3/00	主分类号	H05K3/28
代理机构		代理人
主权项
地址

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