发明名称 |
Semiconductor device with flexible substrate and manufacturing method thereof |
摘要 |
It is an object of the present invention to manufacture, with high yield, semiconductor devices in each of which an element which has a layer containing an organic compound is provided over a flexible substrate. A method for manufacturing a semiconductor device includes: forming a separation layer over a substrate; forming an element-forming layer by forming an inorganic compound layer, a first conductive layer, and a layer containing an organic compound over the separation layer, and forming a second conductive layer which is in contact with the layer containing an organic compound and the inorganic compound layer; and after attaching a first flexible substrate over the second conductive layer, separating the separation layer and the element-forming layer at the separation layer. |
申请公布号 |
EP1760776(A3) |
申请公布日期 |
2015.10.07 |
申请号 |
EP20060016839 |
申请日期 |
2006.08.11 |
申请人 |
SEMICONDUCTOR ENERGY LABORATORY CO., LTD. |
发明人 |
SUZUKI, TSUNENORI;NOMURA, RYOJI;YUKAWA, MIKIO;OHSAWA, NOBUHARU;TAKANO, TAMAE |
分类号 |
H01L21/77;H01L27/12;H01L29/786 |
主分类号 |
H01L21/77 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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