| 摘要 |
Provided is a curable resin composition that adheres well to an inorganic substrate. Said curable resin composition contains the following: a multifunctional thiol compound (A) having a molecular weight of 200 to 2,000; a multifunctional epoxy resin (B) having a molecular weight of 200 to 50,000 and an epoxy equivalent of 80 to 6,000 g/mol; a thioether-containing alkoxysilane derivative (C) represented by general formula (1); and an amine compound (D) having a molecular weight of 90 to 700. The weight of component (A) is 0.05 to 30 times the weight of component (B). The curable resin composition contains 0.5 to 50 weight parts of component (C) and 0.01 to 50 weight parts of component (D) per 100 total weight parts of components (A) and (B). |
