发明名称 半導体装置およびその製造方法
摘要 <p>A semiconductor substrate of a semiconductor device has a sensor region and an integrated circuit region, and a cavity is formed immediately under a surface layer portion of the sensor region. A capacitive acceleration sensor is formed on the sensor region by working a surface layer portion of the semiconductor substrate opposed to the cavity. The capacitive acceleration sensor includes an interdigital fixed electrode and an interdigital movable electrode. A CMIS transistor is formed on the integrated circuit region. The CMIS transistor includes a P-type well region and an N-type well region formed on the surface layer portion of the semiconductor substrate. A gate electrode is opposed to the respective ones of the P-type well region and the N-type well region through a gate insulating film formed on a surface of the semiconductor substrate.</p>
申请公布号 JP5792169(B2) 申请公布日期 2015.10.07
申请号 JP20120522707 申请日期 2011.06.30
申请人 发明人
分类号 G01P15/125;G01C19/5747;G01C19/5769;G01P15/18;H01L29/84 主分类号 G01P15/125
代理机构 代理人
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