| 摘要 |
<p>A semiconductor device includes a plate shaped semiconductor package substrate, a semiconductor chip mounted on the semiconductor package substrate, a plurality of electrodes formed on a lower surface of the semiconductor package substrate, the plurality of electrodes being electrically connected to a mother board; and a connector formed at an end of the semiconductor package substrate. The connector includes a plurality of terminals to be electrically connected to a plurality of spring terminals of a mating connector which is mated in a parallel direction to the semiconductor package substrate.</p> |
