| 摘要 |
A polishing pad auxiliary plate including: a lower auxiliary plate overlapping a top surface of a rotating surface plate of a polishing device; a first adhering member adhering the lower auxiliary plate to the rotating surface plate; an upper auxiliary plate with a pad support surface on which the polishing pad is overlapped and adhered, while overlapping a top surface of the lower auxiliary plate; a second adhering member adhering the upper auxiliary plate to the lower auxiliary plate; and an alignment member for mutually aligning the lower and upper auxiliary plates and matching center axes thereof. By removing the upper auxiliary plate from the lower auxiliary plate, the polishing pad is removed from the rotating surface plate while being adhered to the pad support surface of the upper auxiliary plate, and the removed upper auxiliary plate is reattached and aligned to the lower auxiliary plate by the alignment member. |
