| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To improve the efficiency of a plurality of processes needed between a process of dividing a wafer into a large number of chips by expanding an adhesive tape and a process of bonding the chips, and also to reduce cost. <P>SOLUTION: A heating means 40 for removing the slack of an adhesive tape 6 generated by being expanded by a dividing means 30 and a washing means 50 for washing a wafer 1 by supplying washing water are added to the dividing means 30 for dividing the wafer 1, whereby a process of removing the slack of the adhesive tape 6 and a process of washing the wafer 1 can continuously be carried out. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
