| 摘要 |
A sensor unit (10) is stored in a recessed sensor mount portion (2) formed in a resin case (1). The sensor unit (10) is formed so that a semiconductor pressure sensor chip (11) is joined to one side of a glass pedestal (12), and the other side of the glass pedestal (12) is die-bonded to the bottom of the sensor mount portion (2) through an adhesive (13). An electrode pad on the semiconductor pressure sensor chip (11) is electrically connected through a bonding wire (4) to a lead terminal (3) for leading externally that pierces through the resin case (1) and is integrally insert-molded therein. An entire surface of the sensor unit (10), an exposed part of the lead terminal (3) internally-located in the resin case (1), the bonding wire (4), and an exposed part of an inner wall (1a) of the resin case (1) (including the inner wall of the sensor mount portion (2)) is coated with the protective film (5) composed of a poly( p -xylylene)-family polymer including fluorine. This allows the pressure sensor device to improve reliability. |
