LED package

摘要

The present invention relates to an optical semiconductor device including: a substrate (1) having mounted thereon an LED chip; an encapsulation resin layer (2) embedding the LED chip; an inorganic high-heat conductive layer (3); and a wavelength conversion layer (4) containing an inorganic phosphor powder, in which the encapsulation resin layer (2), the inorganic high-heat conductive layer (3) and the wavelength conversion layer (4) are laminated in this order on the substrate either directly or indirectly.