发明名称 INORGANIC BINDER COMPOSITIONS AND METHOD OF MANUFACTURING IT
摘要 The present invention relates to an inorganic binder composition for manufacturing architectural boards and a manufacturing method of the composition and, more specifically to an inorganic binder composition for manufacturing architectural boards capable of manufacturing an architectural board which is nonflammable and is safe from fire, has excellent water resistance, adhesiveness, and intensity, and is strong at humidity, and to a manufacturing method thereof. The inorganic binder for architectural boards may include: 50-80 wt% of silicic acid; 5-15 wt% of slaked lime or a calcium solution; 4-15 wt% of a boric acid solution or a phosphoric acid solution; 3-15 wt% of power type silica; and 5-25 wt% of liquid type silica sol.
申请公布号 KR20150112469(A) 申请公布日期 2015.10.07
申请号 KR20140036726 申请日期 2014.03.28
申请人 JY COMPANY 发明人 CHO, JUNE YOUNG
分类号 C04B28/26 主分类号 C04B28/26
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