Placement of component in circuit board intermediate product by flowable adhesive layer on carrier substrate

摘要

A method of manufacturing a circuit board carrying components 402 using a carrier structure 100 that has a layer of flowable low-viscosity adhesive 300 with a surface area 302 larger than a required mounting area 404 for the component 402. The component is pressed into a subsection of the layer of adhesive 300 so that at least part of the electronic component (402) is immersed within the adhesive 300. The adhesive area not connected to the component can be used to contact the rest of a PCB assembly such that the component may be embedded in the PCB insulating structures 500, 520. The carrier 300 can then be removed (fig 6) and a layer attached, such as a conductive layer (800) that may connect to contacts 406 of the component.