发明名称 Microfluidic systems
摘要 The systems and methods disclosed herein include a microfluidic system, comprising a pneumatic manifold having a plurality of apertures, and a chip manifold having channels disposed therein for routing pneumatic signals from respective ones of the apertures to a plurality of valves in a microfluidic chip, wherein the channels route the pneumatic signals in accordance with a configuration of the plurality of valves in the microfluidic chip.
申请公布号 US9151701(B2) 申请公布日期 2015.10.06
申请号 US201314103008 申请日期 2013.12.11
申请人 RHEONIX, INC. 发明人 Zhou Peng;Young Lincoln C.
分类号 B01L3/00;F04B19/00;G01N1/10;G01N1/28;F04B43/04;F16K99/00;B01L7/00 主分类号 B01L3/00
代理机构 Bond, Schoeneck & King, PLLC 代理人 Greener William;Bond, Schoeneck & King, PLLC
主权项 1. A microfluidic system, comprising: a modular pneumatic manifold having a plurality of apertures that provide a passage of a pneumatic signal there through; a plurality of modular microfluidic chips each having different respective configurations of microfeatures, diaphragm valves, and pressure-actuatable membranes that are actuated by the pneumatic signal disposed in relation to only a single surface of each microfluidic chip; and a respective plurality of separate, modular chip manifolds corresponding to the plurality of microfluidic chips having pneumatic-only channels disposed therein for routing the pneumatic signal from at least some of the apertures of the pneumatic manifold to at least some of the pressure-actuatable membranes on corresponding ones of the microfluidic chips, wherein the channels route the pneumatic signal in accordance with a configuration of the plurality of pressure-actuatable membranes in the microfluidic chip wherein the respective plurality of separate, modular chip manifolds are each disposed in-between and in direct contact with the respective modular microfluidic chips and the modular pneumatic manifold, and the microfluidic system is a reconfigurable system due to the modular microfluidic chips, the separate, modular replaceable chip manifolds, and the separate, modular pneumatic manifold.
地址 Ithaca NY US