发明名称 Print compatible designs and layout schemes for printed electronics
摘要 Embodiments of the present invention relate to circuit layouts that are compatible with printing electronic inks, printed circuits formed by printing an electronic ink or a combination of printing and conventional blanket deposition and photolithography, and methods of forming circuits by printing electronic inks onto structures having print-compatible shapes. The layouts include features having (i) a print-compatible shape and (ii) an orientation that is either orthogonal or parallel to the orientation of every other feature in the layout.
申请公布号 US9155202(B2) 申请公布日期 2015.10.06
申请号 US201313757649 申请日期 2013.02.01
申请人 Thin Film Electronics ASA 发明人 Wang Zhigang;Subramanian Vivek;Cleveland Lee
分类号 H05K1/00;H05K3/12;G06F17/50;H05K3/00;H01L23/532;H05K1/16;H05K1/02;H01L51/00 主分类号 H05K1/00
代理机构 Central California IP Group, P.C. 代理人 Fortney Andrew D.;Central California IP Group, P.C.
主权项 1. A layout for a printed circuit, comprising: a first layout consisting essentially of a first plurality of features, each of the first plurality of features being orthogonal or parallel to every other feature in the first plurality of features, the first plurality of features comprising (i) first print-compatible shape features and (ii) first and second subsets of features; and a second layout consisting essentially of a second plurality of features, each of the second plurality of features being orthogonal or parallel to every other feature in the first and second plurality of features, the second plurality of features comprising (i) second print-compatible shape features, (ii) a first subset that crosses over the first subset of the first plurality of features, and (iii) a second subset that crosses over the second subset of the first plurality of features.
地址 Oslo NO