| 摘要 |
PURPOSE:To reduce wire trubles in assembling process, by making the longitudinal direction of a bonding wire connecting part connected to an element electrode parallel to a ejection forming guide when a semiconductor element is sealed in a synthetic resin outer container by ejection forming. CONSTITUTION:Leads 1c-1c'' and semiconductor element 2 are fixed on frame 1, which combines the functions of fixing and dissipating heat for a semiconductor device consisting of heat dissipating plate 1a and element fitting bed 1b. Next, leads 1c-1c'' and the electrode provided on element 2 are connected by using bonding wires 23a and 23b and are sealed by using synthetic resin mold 4. At this time, the longitudinal direction of connection of wires 23a and 23b is set nearly parallel to the guide rail for the resin to be inserted into the cavity. That is, the resin which is normally injected from the direction Y is injected from the direction X, parallel to the wires. By this, damage to the element electrode is eliminated and wire troubles are reduced.
|
