Light-emitting device comprising a metal film on a substrate and manufacturing method for the same

摘要

A light-emitting device includes: a substrate; the metal film at the mounting region on the substrate; a light-emitting part including a plurality of light-emitting elements disposed on the metal film; metal members formed on the substrate, respectively including pad parts and wiring parts, forming a positive electrode and a negative electrode configured to apply a voltage to the light-emitting element through the wiring parts, respectively; and a plating wire connected to the metal film, extended to a side face of the substrate. The metal film and the metal members are independently disposed. The wiring part of the positive electrode and the wiring part of the negative electrode are formed at a circumference of the mounting region. The metal members are formed apart from the circumferential edge of the substrate on the side of the mounting region of the substrate.

主权项

1. A light-emitting device comprising:
a substrate; a metal film at a mounting region on the substrate; a light-emitting part including a plurality of light-emitting elements disposed on the metal film; metal members formed on the substrate, respectively including pad parts and wiring parts, forming positive and negative electrodes configured to apply a voltage to the light-emitting element through the wiring parts, respectively; and a plating wire connected to the metal film and extended to a side face of the substrate, wherein
the metal film and the metal members are independently disposed, whereinthe wiring part of the positive electrode and the wiring part of the negative electrode are formed at the periphery of the mounting region, and wherein the metal members are formed apart from a circumferential edge of the substrate on a side of the mounting region of the substrate.