发明名称 Exposure device, substrate processing apparatus, method for exposing substrate and substrate processing method
摘要 In an entire region exposure unit, a platform section and a local transfer mechanism are arranged in one direction. The local transfer mechanism is provided with a local transfer hand. A substrate on which a resist film having a predetermined pattern is formed is held by the local transfer hand. A light-emitting device is attached to the upper portion of the local transfer mechanism. Strip-shaped light is emitted from the light-emitting device toward below. The local transfer mechanism operates such that the local transfer hand is moved relative to the light-emitting device. At this time, the light-emitting device irradiates one surface of the substrate that is moving horizontally with the strip-shaped light. The resist film is modified by the light.
申请公布号 US9152054(B2) 申请公布日期 2015.10.06
申请号 US201313845211 申请日期 2013.03.18
申请人 SCREEN Semiconductor Solutions Co., Ltd. 发明人 Nishimura Kazuhiro;Morita Akihiko;Inagaki Yukihiko
分类号 G03B27/32;G03B27/52;G03F7/20;G03F7/00;G03F7/38 主分类号 G03B27/32
代理机构 Ostrolenk Faber LLP 代理人 Ostrolenk Faber LLP
主权项 1. An exposure device that exposes a substrate, comprising: a holder that holds a substrate having one surface on which a photosensitive film having a predetermined pattern is formed; a light emitter that emits light for modifying the photosensitive film; and a relative mover that is configured to move at least one of the holder and the light emitter relative to the other such that the one surface of the substrate held by the holder is irradiated with the light emitted by the light emitter; wherein the light emitter is arranged so as to emit the light to a space between a first position and a second position that are spaced apart from each other, and the relative mover is configured to move the holder that holds the substrate between the first position and the second position; further comprising a first temperature processor that is provided at the first position, has a contact surface with which the holder can come into contact and performs first temperature processing on the substrate held b the holder while the holder is in contact with the contact surface; a second temperature processor that is configured to be capable of supporting the substrate at the second position and performs second temperature processing on the substrate; and an interface mechanism for receiving and transferring the substrate between the holder and the second temperature processor, wherein the relative mover is configured to move the holder to the first position such that the holder holding the substrate comes into contact with the contact surface of the first temperature processor.
地址 JP