Multi-axis integrated MEMS devices with CMOS circuits and method therefor

摘要

An integrated multi-axis mechanical device and integrated circuit system. The integrated system can include a silicon substrate layer, a CMOS device region, four or more mechanical devices, and a wafer level packaging (WLP) layer. The CMOS layer can form an interface region, on which any number of CMOS and mechanical devices can be configured. The mechanical devices can include MEMS devices configured for multiple axes or for at least a first direction. The CMOS layer can be deposited on the silicon substrate and can include any number of metal layers and can be provided on any type of design rule. The integrated MEMS devices can include, but not exclusively, any combination of the following types of sensors: magnetic, pressure, humidity, temperature, chemical, biological, or inertial. Furthermore, the overlying WLP layer can be configured to hermetically seal any number of these integrated devices.

主权项

1. A method for fabricating an integrated multi-axis mechanical device and integrated circuit system comprising:
providing a substrate member; forming one or more CMOS devices upon the substrate member; forming an interface layer on top of the one or more CMOS devices; and forming at least four different MEMS physical sensors upon the interface layer using a foundry compatible process; wherein forming the at least four different MEMS physical sensors comprises at least:
forming a gyroscope device comprising at least a first gyro axis, a second gyro axis, and a third gyro axis;forming an accelerometer device comprising at least a first accel axis, a second accel axis, and a third accel axis;forming a magnetic field sensing device comprising at least a first mag axis, a second mag axis, and a third mag axis; andforming a pressure sensor device configured to detect a force in at least a direction; and forming one or more bonding structures provided through a thickness of the substrate member, each of the bonding structures comprising a bonding pad, a via structure, and a pad structure.