Cooling system for a server

摘要

Embodiments of the disclosure may include a system for cooling a computer server including a plurality of server modules. The system may include a first cooling system configured to remove heat from the plurality of server modules, the first cooling system including a first plurality of conduits for circulating a first cooling medium through the first cooling system, a second cooling system configured to remove heat from the first cooling system, the second cooling system including a second plurality of conduits for circulating a second cooling medium through the second cooling system, and a manifold configured to couple the first cooling system and the second cooling system, wherein the first plurality of conduits is removably connected to the manifold.

主权项

1. A system for cooling a computer server including one or more server modules, the system comprising:
a first plurality of conduits for circulating a first cooling medium among the one or more server modules, wherein the first plurality of conduits includes at least one server cold plate dimensioned to thermally connect to at least one heat generating component of the one or more server modules; a second plurality of conduits for circulating a second cooling medium through a cooling device positioned at a location remote from the computer server; and a fluid distribution and collection manifold including:
at least one first inlet line having a first inlet fluid connector for fluidly and removably connecting to the first plurality of conduits to collect the first cooling medium from the first plurality of conduits;at least one first outlet line having a first outlet fluid connector for fluidly and removably connecting to the first plurality of conduits to distribute the first cooling medium to the first plurality of conduits;at least one second inlet line having a second inlet fluid connector for fluidly and removably connecting to the second plurality of conduits to collect the second cooling medium from the second plurality of conduits;at least one second outlet line having a second outlet fluid connector for fluidly and removably connecting to the second plurality of conduits to distribute the second cooling medium to the second plurality of conduits;a hot plate; anda cold plate thermally coupled to the hot plate; wherein, when connected to the manifold via the first outlet and first inlet fluid connectors, the first plurality of conduits and the first inlet and first outlet lines form a first fluid loop that allows the first cooling medium to circulate between the first plurality of conduits, the first inlet and first outlet lines, and the hot plate to transfer the heat from the one or more server modules to the hot plate; and wherein, when connected to the manifold via the second outlet and second inlet fluid connectors, the second plurality of conduits and the second inlet and second outlet lines form a second fluid loop, separate from the first fluid loop, that allows the second cooling medium to circulate between the second plurality of conduits, the second inlet and second outlet lines, and the cold plate to transfer the heat from the cold plate to the cooling device at the location remote from the computer server.