发明名称 Preparation of articles with conductive micro-wire pattern
摘要 Conductive articles and devices have conductive micro-wires formed by curing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C. The photocurable layer has a viscosity <5,000 Pascal-seconds at the temperature micro-channels formation and the micro-channels having an average width of less than or equal to 4 μm and an average depth to average width ratio that is greater than or equal to 1. The photocurable layer is exposed to curing ultraviolet radiation to form a pattern of photocured micro-channels and a conductive composition comprising metal nano-particles is formed in the photocured micro-channels. The conductive composition is cured in the pattern of photocured micro-channels to provide a pattern of conductive micro-wires in the pattern of photocured micro-channels on the transparent flexible substrate. Each of at least 50% of the conductive micro-wires has a sheet resistance of less than 0.025 ohms/sq.
申请公布号 US9155201(B2) 申请公布日期 2015.10.06
申请号 US201314094841 申请日期 2013.12.03
申请人 EASTMAN KODAK COMPANY 发明人 Wang Yongcai;Lebens John Andrew;Wright Mitchell Lawrence;Cummings Julie A.
分类号 H05K1/09;H05K3/00;H05K1/02;H05K3/04;H05K3/22 主分类号 H05K1/09
代理机构 代理人 Tucker J. Lanny
主权项 1. A method for making a micro-wire pattern in an article, the method comprising: providing a photocurable layer on a transparent flexible substrate that has a distortion temperature of less than 150° C., forming a pattern of micro-channels within the photocurable layer that has a viscosity of less than 5,000 Pascal-seconds at the temperature at which the micro-channels are formed, the micro-channels having an average width of less than or equal to 4 μm and an average depth to average width ratio that is greater than or equal to 1, exposing the photocurable layer to curing ultraviolet radiation to form a pattern of photocured micro-channels within a photocured layer on the transparent flexible substrate, the photocured micro-channels having an average width of less than or equal to 4 μm and an average depth to average width ratio that is greater than or equal to 1, applying a conductive composition comprising metal nano-particles to the photocured micro-channels, removing any excess conductive composition outside the photocured micro-channels while leaving conductive composition within the pattern of photocured micro-channels, curing the conductive composition in the pattern of photocured micro-channels to provide a pattern of conductive micro-wires in the pattern of photocured micro-channels on the transparent flexible substrate, and optionally, polishing the pattern of conductive micro-wires on the transparent flexible substrate, wherein each of at least 50% of the conductive micro-wires has a sheet resistance of less than 0.025 ohms/sq.
地址 Rochester NY US