Fusing method of substrate layer, manufacturing method of microfluidic chip and fusing apparatus of substrate layer

摘要

Provided is a fusing method of a substrate layer including: treating a joining surface of a substrate layer formed from a resin using an organic solvent having solubility with respect to the resin; and heating the treated substrate layer at less than a glass transition temperature or a softening point temperature of the resin and crimping the heated substrate layer.

主权项

1. A method of fusing a first substrate layer and a second substrate layer comprising:
treating a joining surface of one of the first substrate layer and the second substrate layer formed from a resin using an organic solvent having solubility with respect to the resin; heating the first substrate layer and the second substrate layer after the organic solvent treatment at a heating temperature less than a glass transition temperature or a softening point temperature of the resin and crimping the heated substrate layers together; removing the organic solvent remaining on the crimped substrate layers; and pressurizing the crimped substrate layers after removing the organic solvent while heating at a temperature which is higher than the heating temperature and lower than the glass transition temperature or the softening point temperature of the resin.