发明名称 Insulated gate bipolar transistor
摘要 A semiconductor device is disclosed. One embodiment provides a cell area and a junction termination area at a first side of a semiconductor zone of a first conductivity type. At least one first region of a second conductivity type is formed at a second side of the semiconductor zone. The at least one first region is opposed to the cell area region. At least one second region of the second conductivity type is formed at the second side of the semiconductor zone. The at least one second region is opposed to the cell area region and has a lateral dimension smaller than the at least first region.
申请公布号 US9153674(B2) 申请公布日期 2015.10.06
申请号 US200912421322 申请日期 2009.04.09
申请人 Infineon Technologies Austria AG 发明人 Schulze Hans-Joachim
分类号 H01L29/739;H01L29/06;H01L29/10 主分类号 H01L29/739
代理机构 Dicke, Billig & Czaja, PLLC 代理人 Dicke, Billig & Czaja, PLLC
主权项 1. An insulated gate bipolar transistor, comprising: a transistor cell area including source, body regions, and gates and a junction termination area at a first side of a semiconductor zone of a first conductivity type; an emitter region of a second conductivity type at a second side of the semiconductor zone, the emitter region being opposed to the cell area region; at least one second region of the second conductivity type at the second side of the semiconductor zone, wherein the at least one second region is opposed to and covered by the cell area region and each of the at least one second region is disposed at a lateral distance from the emitter region and has a lateral dimension smaller than the emitter region, and wherein the at least one second region is configured to inject charge carriers into the semiconductor zone via a terminal at the second side; and a third region of the second conductivity type at the second side of the semiconductor zone, the third region being arranged in an area including at least part of both the emitter region and the at least one second region, and wherein a maximum dopant concentration of the third region is smaller than the maximum dopant concentration of the emitter region, wherein the at least one second region is arranged between the emitter region and the junction termination area; and wherein each of the emitter region, the at least one second region and the third region extend from a common surface at the second side into the semiconductor zone.
地址 Villach AU