| 发明名称 | ASIC element including a via | ||
| 摘要 | In an ASIC element, vias are integrated into the CMOS processing of an ASIC substrate. The ASIC element includes an active front side in which the circuit functions are implemented. The at least one via is intended to establish an electrical connection between the active front side and the rear side of the element. The front side of the via is defined by at least one front-side trench which is completely filled, and the rear side is defined by at least one rear-side trench which is not completely filled. The rear-side trench opens into the filled front-side trench. | ||
| 申请公布号 | US9153523(B2) | 申请公布日期 | 2015.10.06 |
| 申请号 | US201414307108 | 申请日期 | 2014.06.17 |
| 申请人 | ROBERT BOSCH GMBH | 发明人 | Weber Heribert;Kueppers Hartmut;Reinmuth Jochen;Davies Neil;Frey Jens |
| 分类号 | H01L23/52;H01L23/48;B81C3/00 | 主分类号 | H01L23/52 |
| 代理机构 | Kenyon & Kenyon LLP | 代理人 | Kenyon & Kenyon LLP |
| 主权项 | 1. An ASIC element, comprising: an active front side in which circuit functions are implemented; and at least one via which establishes an electrical connection between the active front side and a rear side of the ASIC element; wherein the front side of the via is defined by at least one front-side trench which is completely filled, and wherein the rear side of the via is defined by at least one rear-side trench which is not completely filled, the rear-side trench opening into the filled front-side trench. | ||
| 地址 | Stuttgart DE | ||