Film-covered open-cavity sensor package

摘要

Techniques for covering open-cavity integrated-circuit packages in a batch process are disclosed. In an example method, a plurality of open-cavity packages are molded on a single batch leadframe or substrate, each open-cavity package comprising a floor and a plurality of walls arranged around the floor to form a cavity, each of said the walls having a bottom end adjoining said floor and having a top side opposite the bottom end. At least one semiconductor device is attached to the floor and within the cavity of each of the open-cavity packages, and a single flexible membrane is affixed to the top sides of the walls of the plurality of open-cavity packages, so as to substantially cover all of the cavities. The flexible membrane is then severed, between the packages.

主权项

1. An integrated-circuit module, comprising:
an open-cavity package comprising a floor and a plurality of walls arranged around the floor to form a cavity, each of said walls having a bottom end adjoining said floor and having a top side opposite the bottom end; a semiconductor device attached to the floor of the open-cavity package, within the cavity; and a flexible membrane affixed to the top sides of said walls so as to substantially cover the cavity, wherein the flexible membrane comprises nitrocellulose.