Semiconductor die connection system and method

摘要

A system and method for connecting semiconductor dies is provided. An embodiment comprises connecting a first semiconductor die with a first width to a second semiconductor die with a larger second width and that is still connected to a semiconductor wafer. The first semiconductor die is encapsulated after it is connected, and the encapsulant and first semiconductor die are thinned to expose a through substrate via within the first semiconductor die. The second semiconductor die is singulated from the semiconductor wafer, and the combined first semiconductor die and second semiconductor die are then connected to another substrate.

主权项

1. A semiconductor device comprising:
a first die with a first width over a second die with a second width, wherein the second width is larger than the first width; through substrate vias extending through the first die; and an encapsulant having a top surface of the encapsulant planar with a top surface of the first die and a second edge in physical contact with and planar with a side surface of the second die.