Composition and methods of forming solder bump and flip chip using the same

摘要

Provided are a composition for an anisotropic conductive adhesive, a method of forming a solder bump and a method of forming a flip chip using the same. The composition for an anisotropic conductive adhesive includes a low melting point solder particle and a thermo-curable polymer resin. The anisotropic conductive adhesive includes forming a mixture by mixing a polymer resin and a curing agent, and mixing a deforming agent, a catalyst or a reductant with the mixture.

主权项

1. A method of forming a flip chip, comprising:
preparing a first substrate on which first conductive patterns are formed and a second substrate on which second conductive patterns are formed; providing a first composition on the first substrate to cover the first conductive patterns, the first composition comprising a low melting point solder, a thermal-curable polymer resin, and a curing agent of an anhydride family material; forming first solder patterns on the first conductive patterns by agglomerating the low melting point solder; and assembling the first substrate and the second substrate to electrically connect the first conductive patterns to the second conductive patterns through the first solder patterns.