发明名称 Thermally controlled assembly
摘要 A thermally controlled assembly having two parallel PCBs defining there between, and by the aid of a channel forming element, a channel in which air is forced, using a fan, to cool components in the channel. The fan has a cooling surface cooled by air from the fan and which is biased toward an element provided in a space below the cooling surface. The forced air also drawing air from outside the assembly through the space and into the channel to cool other elements provided in the space.
申请公布号 US9155223(B2) 申请公布日期 2015.10.06
申请号 US201113642577 申请日期 2011.04.19
申请人 NaPatech A/S 发明人 Ek Claus
分类号 H05K7/20;H05K1/14 主分类号 H05K7/20
代理机构 McHale & Slavin, P.A. 代理人 McHale & Slavin, P.A.
主权项 1. An assembly comprising: a first PCB having a first side and a second side, one or more first electrical components being positioned at the first side of the first PCB, a second PCB with a first side and a second side, one or more second electrical components being positioned at the first side of the second PCB, the first side of the first PCB facing the first side of the second PCB, a channel forming element, with at least a part of the first side of the first PCB and at least a part of the first side of the second PCB, forming a channel, the channel having a first end and a second end, a slit being provided in the channel forming element, and an air forcing element positioned to force air through the channel from the first end thereof toward the second end thereof, the air forcing element comprising a cooling surface and biasing elements biasing the cooling surface against at least one component of the one or more first components or the one or more second components, the cooling surface defining a space wherein the at least one component is positioned, wherein the slit being positioned so that air may be drawn there through, due to a venturi effect, into the space and into the channel.
地址 Søborg DK