Apparatus for manufacturing flexible printed wiring board, apparatus for manufacturing wiring board, and applying device

摘要

According to one embodiment, an apparatus includes: a device configured to partially provide a second conductor layer on a surface of a first conductor layer; a device configured to partially provide a first insulating layer on the surface of the first conductor layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer; a device configured to form a conductor pattern by partially removing at least one of the first conductor layer and the third conductor layer in a structure obtained by the integrating; and a device configured to cover both sides of the structure.

主权项

1. An apparatus for manufacturing a flexible printed wiring board, the apparatus comprising:
a device configured to selectively provide a second conductor layer on a surface of a first conductor layer by selectively applying an electrically conductive paste onto the surface of the first conductor layer by screen printing or ink jet printing; a device configured to selectively provide a first insulating layer on the surface of the first conductor layer by selectively applying an insulating resin onto the surface of the first conductor layer by screen printing or ink jet printing, such that the second conductor layer and the first insulating layer are applied to different portions of the first conductor layer, the second conductor layer having a greater height than the first insulating layer; a device configured to integrate the first conductor layer, the second conductor layer, the first insulating layer, and a third conductor layer, in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from a side opposite the first conductor layer by pressing and heating in a state in which the second conductor layer and the first insulating layer provided on the surface of the first conductor layer are covered with the third conductor layer from the side opposite the first conductor layer and in which the first conductor layer and the third conductor layer are sandwiched between presses; a device configured to form a conductor pattern by selectively removing at least one of the first conductor layer and the third conductor layer in a structure obtained by integrating the first conductor layer, the second conductor layer, the first insulating layer, and the third conductor layer; a device configured to cover both sides of the structure in which the conductor pattern is formed with second insulating layers; and a device configured to sandwich the structure in a thickness direction of the structure via cushion materials and press the structure in the thickness direction, wherein the first conductor layer and the third conductor layer have a greater hardness than the second conductor layer and the first insulating layer, and the device configured to press the structure sandwiches the structure to different thicknesses depending on a position in the structure, by varying a thickness of the cushion materials at different positions in the cushion materials.