Electromagnetic interference shielding techniques

摘要

Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

主权项

1. An apparatus comprising:
a circuit board comprising a first surface and a second surface; a first integrated circuit coupled to the first surface of the circuit board; a first pad on the first surface of the circuit board adjacent the first integrated circuit; a second pad on one of the first surface of the circuit board and the second surface of the circuit board; a conductive layer, wherein the conductive layer is electrically coupled to the first pad, wherein the conductive layer is electrically coupled to the second pad, and wherein the conductive layer covers at least a portion of the first integrated circuit; and a fence electrically coupled to the first pad, wherein the conductive layer is electrically coupled to the first pad via the fence, wherein the fence has a top surface, wherein the integrated circuit has a top surface, and wherein the conductive layer has a planar portion that is in direct contact with the top surface of the fence and the top surface of the integrated circuit.