| 发明名称 | Ultrasonic probe and manufacturing method thereof | ||
| 摘要 | Disclosed herein are an ultrasonic probe having a backing layer formed of a structure which varies acoustic impedance and a manufacturing method thereof. The ultrasonic probe includes a piezoelectric layer and a backing layer provided on a rear surface of the piezoelectric layer, and the backing layer includes a plurality of kerfs formed on a front surface thereof in a lengthwise direction, the front surface being adjacent to the rear surface of the piezoelectric layer, and the kerfs are formed such that the intervals between the kerfs are varied. | ||
| 申请公布号 | US9153767(B2) | 申请公布日期 | 2015.10.06 |
| 申请号 | US201213713071 | 申请日期 | 2012.12.13 |
| 申请人 | SAMSUNG ELECTRONICS CO., LTD. | 发明人 | Kim Dong Hyun |
| 分类号 | H01L41/00;H01L41/22;H01L41/09;H01L41/31;G10K11/00 | 主分类号 | H01L41/00 |
| 代理机构 | Sughrue Mion, PLLC | 代理人 | Sughrue Mion, PLLC |
| 主权项 | 1. An ultrasonic probe comprising: a piezoelectric layer; and a backing layer provided on a rear surface of the piezoelectric layer, wherein the backing layer includes a plurality of kerfs formed on a front surface thereof in a lengthwise direction, the front surface being adjacent to the rear surface of the piezoelectric layer, and the kerfs are formed such that the intervals between the kerfs are varied. | ||
| 地址 | Suwon-si KR | ||