发明名称 Substrate processing apparatus, substrate processing method and non-transitory computer-readable storage medium
摘要 A substrate processing apparatus includes a control unit performing loading substrates into a second unit block when a trouble occurs in a module of a first unit block; determining whether it is before a leading substrate of a next lot of the lot where a standby substrate positioned in upper stream side than the troubled module belongs is loaded into the module in the uppermost stage of the second unit block; loading the standby substrate into the module in the uppermost stage of the second unit block when determined it is before the loading of the leading substrate and loading the standby substrate into the module in the uppermost stage of the second unit block after a rearmost substrate of the next lot is loaded into the module in the uppermost stage of the second unit block when determined otherwise; and performing a series of processing on the standby substrate.
申请公布号 US9153467(B2) 申请公布日期 2015.10.06
申请号 US201313748295 申请日期 2013.01.23
申请人 TOKYO ELECTRON LIMITED 发明人 Matsuyama Kenichirou
分类号 H01L21/677;H01L21/67;H01L21/027 主分类号 H01L21/677
代理机构 Nath, Goldberg & Meyer 代理人 Nath, Goldberg & Meyer ;Meyer Jerald L.
主权项 1. A substrate processing apparatus comprising: a processing block including a plurality of unit blocks including a first unit block and a second unit block, each of the plurality of unit blocks configured to perform a same series of processing; a plurality of lots of substrates including a first lot and a second lot, each of the plurality of lots configured to be loaded into the processing block, the second lot to be loaded into the processing block after the first lot, wherein each of the plurality of unit blocks includes a group of modules configured to perform the same series of processing on substrates, and a first transfer mechanism configured to sequentially transfer the substrates from modules in an upper stream side of the group of modules to modules in a lower stream side of the group of modules, and the substrates loaded into the processing block are sequentially distributed to the group of modules in an uppermost stage of each of the plurality of unit blocks by a second transfer mechanism, and subjected to the same series of processing at each of the plurality of unit blocks where the substrates are distributed; and a control unit configured to control the substrate processing apparatus to perform: stopping the loading of the substrates into the first unit block and operating the second transfer mechanism so as to load the substrates into the second unit block when a trouble is detected in a module of the first unit block, where a standby substrate is positioned in a module in the upper stream side of the troubled module of the first unit block;controlling the first and second transfer mechanisms such that when a leading substrate of the second lot has been determined not to have been loaded into a module in the uppermost stage of the second unit block, the standby substrate is loaded into the module in the uppermost stage of the second unit block before loading the leading substrate, and when the leading substrate has been determined to have been loaded in the uppermost stage of the second unit block, the standby substrate is loaded into the module in the uppermost stage of the second unit block after a rearmost substrate of the second lot is loaded into the module in the uppermost stage of the second unit block;controlling the first transfer mechanism of the second unit block so as to perform the same series of processing on the standby substrate loaded into the module in the uppermost stage of the second unit block; andwhen the trouble is detected, transferring the processed substrates from the second unit block into a standby module until the standby substrate is processed in the second unit block and transferred into the standby module, and adjusting an order of the processed substrates and the standby substrate in the buffer so that the standby substrate is transferred out from the buffer before the processed substrates.
地址 Tokyo JP