发明名称 |
Modification of silicon layers formed from silane-containing formulations |
摘要 |
The invention relates to a process for producing an oxygen-containing surface or interface of a silicon layer, which is arranged on a substrate, especially in the production of photovoltaic units. |
申请公布号 |
US9153432(B2) |
申请公布日期 |
2015.10.06 |
申请号 |
US201113807852 |
申请日期 |
2011.06.20 |
申请人 |
Evonik Degussa GmbH |
发明人 |
Stuetzel Bernhard;Fahrner Wolfgang |
分类号 |
H01L21/02;C23C18/12;C23C18/14;H01L29/16;H01L31/0376;H01L31/075;H01L31/18 |
主分类号 |
H01L21/02 |
代理机构 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
代理人 |
Oblon, McClelland, Maier & Neustadt, L.L.P. |
主权项 |
1. A process for preparing a silicon layer on a substrate, the silicon layer comprising silicon and a surface suboxide structure, the process comprising:
(I) applying a formulation comprising at least one silicon compound to the substrate, to obtain a coated substrate; (II) irradiating, thermally treating, or irradiating and thermally treating the coated substrate to form a silicon layer; (III) treating the silicon layer with at least one oxygen source selected from the group consisting of elemental oxygen, O3, carbon dioxide, and an oxygen-comprising compound, wherein the oxygen source is in pure form or a liquid or gaseous mixture; and (IV) irradiating, thermally treating, or irradiating and thermally treating the oxygen treated coated substrate, to form the silicon layer comprising suboxide structures on a surface of the layer. |
地址 |
Essen DE |