Display apparatus manufacturing method

摘要

A thin film encapsulation manufacturing apparatus includes a first cluster configured to form a first inorganic layer on a first substrate, on which an emission unit is formed, by a sputtering process; a second cluster configured to form a first organic layer on the first inorganic layer on the first substrate conveyed from the first cluster by an organic deposition process; a first connection module configured to connect the first cluster and the second cluster, configured to convey the first substrate on which the first inorganic layer is formed from the first cluster to the second cluster, and configured to cool the first substrate in a non-contact manner; and a third cluster configured to form a second inorganic layer on the first organic layer on the first substrate conveyed from the second cluster by a chemical vapor deposition (CVD) process or a plasma enhanced chemical vapor deposition (PECVD) process.

主权项

1. A method of manufacturing a display apparatus, the method comprising:
forming a first inorganic layer on a first substrate, on which an emission unit is formed, by a sputtering process; cooling the first substrate on which the first inorganic layer is formed by absorbing radiation emitted therefrom in a non-contact manner; forming a first organic layer on the first inorganic layer by an organic deposition process; and forming a second inorganic layer on the first organic layer.